Exposure System
Exposure Modes: Vacuum contact
Resolution: 0.5-0.8µ
Exposure Modes: Hard contact
Resolution: 0.8-1.0µ
Exposure Modes: Soft contact
Resolution: 1.0-3.0µ
Exposure Modes: Proximity
Resolution: 3.0µ
Advanced Beam Optics
Long working distance light source allows for all fixed optical components and more exposures
Uniform Beam Size: 4*-300mm square/round 200mm -300mm square/round
Uniformity: Better than ±3%
Camera: Dual Camera GigE with large feld of view
Alignment System
Pattern Recognition: Cognex VisionPro™ with OAl customized software
Alignment Accuracy:
0.5µ topside
1.Oµ with top to bottom optional backside alignment
Pre-alignment Accuracy: Better than ±50µ
Auto-alignment:
Top to bottom side
Topside
Wafer Handling
Substrate size: 4"-300mm round or square or 200mm-300mm round or square
Thin wafers: Down to 100u
Warped Wafers: Up to 7mm-10mm
Thick & Bonded Substrates: Up to 7000µ
Robotics: Single and dual arm wafer handling for highest throughput
Run-out compensation: Standard software or optional thermal chuck
Wafer size conversion: 5 minutes or less
Throughput: 1st mask 200 wafers per hour
Wedge Effect Leveling: 3 point or optional non-contact laser gap measurement
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