ShuttleStar PS400 BGA 返修台

Specifications：
PCB dimension: W20*D20~W350*D350mm
PCB thinkness: 0.5~4mm
BGA dimension: 1*1~70*70mm
Working table adjustment: ±10MM forward/backward,±10MM left/right
Lower hot-air heater: 1000W
Upper hot-air heater: 1000W
Bottom preheatfar infrared: 3000W
Temperatur control: K-type thermocoupleclose cycle controlled
PCB locating way: Outer or Jig
Min pitch of BGA ball:0.15mm
Placement precision:±0.02mm
Max BGA weight:300g
Power supply: single-phase 220V,50/60Hz,4.5KW
Machine dimension: L600*W600*H750mm 
Weight: Appox 60Kgs

Features：
The streamline design is gorgeous and room-saving;
Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
Upper/lower hot-air heating,bottom infrared,three independent heating areas, temperature
and time can be displayed digitally on the touch screen;
Powerful cross flow fans cool the bottom heating zone rapidly and constantly;
Color optical system with functions of spilt vision, zoom-in and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27X optical focus;
Embedded industrial computer, PLC control, real-time temperature profile display, can display set profiles and 5 practically-tested profiles; able to analyze the 5 practical, and compare with the history saved profiles.
10” color LCD monitor, can be replaced to 12”, or 14” LCD display screen;
Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-adjustable;
8 segments of temperature up (down) and 8 segments of constant temperature control, no limited profile curves can be stored in the industrial compute;
Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
Equipped with different hot air nozzles, easy to replace and able to locate in any angle;
Big size splint, equipped with deformation-proof supporting device,suitable for the accurate rework of all kinds of PCB.