SPIROX MA6500 宏观检查系统 (300μm ~ 2000μm, 8 and12 inch)

Function

Replace IQC visual inspection on surface defects (Including particles, scratches, etc.)

Auto-storing wafer surface defects image and position coordinate records

Wafer

Compatible with 8-inch and 12-inch ｗafer

Wafer Thickness: 300μm ~ 2000μm

Wafer Handling

Support automatic opening function for 12-inch FOUP cassette

Wafer ID Scan

Pre-aligner (Notch Location)

Optical

Camera: 65 Mega Pixel and Telecentric Lens

FOV: 29mm x 22mm

Chuck

Support wafer leveling function

Stage Flatnes < 15μm

X/Y Axis Accuracy: ±1.7μm

Wafer Alignment

Image Auto-Inspection

Defect Size: > 10μm

Discoloration Inspection

Scratches Inspection

Contamination Inspection

Process Defects Inspection

Software

Compatible with Wafer ID OCR

Output Format: .bmp or .jpg

Online Review System

Storing Operation Logs

Inspection Time

90 seconds / 8-inch Wafer

150 seconds / 12-inch Wafer

* Exclusive of photo shooting and equipment loading / unloading time

Optional

Offline Review System

Customized Report

Datasheet