Universal Instruments Innova Direct Die Feeders コンポーネント包装機

Name: Universal Instruments Innova Direct Die Feeders コンポーネント包装機
Brand: Universal Instruments

制造商Universal Instruments(查看更多该品牌的产品)

ModelInnova Direct Die Feeders

保修1 年

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Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible GenesisSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

Ideal for SiP applications
High-mix to high-volume support
Handles up to 300mm wafers
Inline barcode scanning supports ALPs or Inkless wafer maps
Supports up to 4 per machine

INNOVA MODELS & SPECIFICATIONS

Innova - High-speed flip chip and bare die presentation from a single wafer

Innova + - High-speed flip chip and bare die presentation with a cassette supporting up to 13 wafers

Datasheet:

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