OAI 6000 自动正面和背面掩模对准系统

Exposure System

Exposure Modes: Vacuum contact

Resolution: 0.5-0.8µ

Exposure Modes: Hard contact

Resolution: 0.8-1.0µ

Exposure Modes: Soft contact 

Resolution: 1.0-3.0µ

Exposure Modes: Proximity

Resolution: 3.0µ

Advanced Beam Optics

Long working distance light source allows for all fixed optical components and more exposures

Uniform Beam Size: 4*-300mm square/round 200mm -300mm square/round

Uniformity: Better than ±3%

Camera: Dual Camera GigE with large feld of view

Alignment System

Pattern Recognition: Cognex VisionPro™ with OAl customized software

Alignment Accuracy: 0.5µ topside

    1.Oµ with top to bottom optional backside alignment

Pre-alignment Accuracy: Better than ±50µ

Auto-alignment: Top to bottom side

Topside

Wafer Handling

Substrate size: 4"-300mm round or square or 200mm-300mm round or square

Thin wafers: Down to 100u

Warped Wafers: Up to 7mm-10mm

Thick & Bonded Substrates: Up to 7000µ

Robotics: Single and dual arm wafer handling for highest throughput

Run-out compensation: Standard software or optional thermal chuck

Wafer size conversion: 5 minutes or less

Throughput: 1st mask 200 wafers per hour

Wedge Effect Leveling: 3 point or optional non-contact laser gap measurement