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OAI AML 晶圆接合机

Unique In-situ alignment system (X,Y,Z & θ)

• Up to 1 micron accuracy manual & Auto alignment

• Full automatic PC control & data acquisition,

• Application of High Voltage up to 2.5KV

• Temperatures up to 560oC,

• Forces up to 25000 to 100000 N

• Self contained dry pumping system (Turbo & back pump) for vacuum up to 10-6 mBar.

• Forced nitrogen cooling.

• 2” to 8” wafers (Depending on model chosen)

• RAD Wafer activation for low T bonding

• Water cooling

Details

Data sheet

  • 质量承诺
  • 正品保修
  • 送货到家
  • 交易简单化

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