Dimensions: 517 (L) × 340 (W) × 380 (H) mm
Maximum board size: 350 (L) × 280 (W) mm
height: 200 mm
Fine adjustment height: 60 mm
Detail
Features:
1. The new modular work platform makes maintenance easier.
2. Simultaneous heating up and down, especially suitable for removing BGA and other chips that need to be preheated.
3. It can be adjusted according to the size of the board.
4. The function of the vacuum aspirating chip can be selected as needed.
Datasheet
- 质量承诺
- 正品保修
- 送货到家
- 交易简单化