Dimension:1050(L) x 570(W) x 750(H) m/m
Thickness Range:0.8 - 1.2 & 1.6 - 2.0mm
RPM of Spindle:4500
Min. Lead Height:1.0mm Min
MAX.PCB Working Size:400mm(L) x 270mm(W)
The machine is designed to trim the wire leads of PCB assembly after soldering proces.
The fast turning tungsten carbide blade cuts the wire leads while feeding the PCB one by one to the equipped track manually.
For safety, it is absolutely required to push the PCB assembly by handle.
This machine is for trimming the wire lead of electronics components only.
The Tungsten Carbide Blade is excluded in the machine.