ShuttleStar RW-E500A BGA 返修台

PCB dimension: W20*D20~W600*D500mm
PCB thickness: 0.5~4mm
Placement precision: ±0.02mm
Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close loop controlled
PCB locating way: Outer or jig
Preheater: far infrared, 6000W
Upper heater: hot air, 1000W
Lower heater: hot air, 1000W
Power supply: single-phase 380V, 50/60Hz, 10KW
Machine dimension: L1350*W800*H1800mm
Air supply: 5~8kgf/cm, 8L/min
Weight: Appox. 180kg


Hot air head and mounting head are designed 2 in 1, and, can store 5,0000 groups
of working locations,with the function of auto soldering and mounting;
Driven by X and Y axes step motor, operated with rocker bar ,
micro-movable when approaching the destination;able to store unlimited data;
able to automatically suck BGA for soldering; after that, automatically place BGA to designated location;
Color optical system with functions of split vision, zoom-in and micro-adjustment,
equipped with abbreviation   detection device, auto focus, software operation,
30X optical focus, able to rework BGA sized up to 70mm×70mm;
Embedded industrial computer, touch screen interface, PLC control,
real-time temperature curve display,  able to display set curves and 9 detecting curves at the same time;
Color LCD monitor;
Suction nozzle can identify automatically material and mounting height,
can constrain the pressure within a small  range of 30~50g;
Connected with nitrogen outside for nitrogen-protected soldering and desoldering;
Build-in vacuum pump, 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;
8 segments of temperature up (down) and 8 segments constant temperature control,
 5,0000 groups of temperature curve are stored, connected with computer, unlimited storage of curves;
 curve analysis can be carried out on the touch screen, comparing with the history saved curves;
 with computer communication function, communication software is attached;
Three independent heating areas, temperature and time can be displayed digitally on the touch screen,
can rework CGA;
Both upper and lower hot-air heating heads are movable on the IR preheating area to fit for reworking BGA
 in different positions on PCB;
Control independently through external computer, and finish all functions;
Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect;
 heating board is independently controlled;
Equipped with different alloy hot air nozzles, easy to replace, be able to locate in any angle.


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