Universal Instruments Innova Direct Die Feeders コンポーネント包装機

Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible GenesisSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

  • Ideal for SiP applications

  • High-mix to high-volume support

  • Handles up to 300mm wafers

  • Inline barcode scanning supports ALPs or Inkless wafer maps

  • Supports up to 4 per machine


                    INNOVA MODELS & SPECIFICATIONS

                    Innova - High-speed flip chip and bare die presentation from a single wafer
                    Innova + - High-speed flip chip and bare die presentation with a cassette supporting up to 13 wafers 

                    Detail

                    Datasheet:


                    • 质量承诺
                    • 正品保修
                    • 送货到家
                    • 交易简单化