Universal Instrumnets FuzionSC Platform 贴片机

  • 制造商: Universal Instruments
    Model: FuzionSC Platform
    保障: 12 month
    • 报价要求 报价要求
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Manufacturer: Universal Instruments - USA

Model: FuzionSC Platform

Warranty: 12 months

Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits?

Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.

  • Silicon/SMT, high-accuracy/high-speed assembly

  • High accuracy: (±10µm, < 3µm placement repeatability)

  • Dual- or single-beam, multiple-spindle heads

  • Full range of die and component types and sizes

  • Versatile substrate handling

  • Broadest range of feeding platforms

  • Low-maintenance, accurate over time

  • Vision robustness recognition of pins or logic pads

  • Stacking support (POP)

  • Low-force capability


                    FuzionSC1-11 - Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
                    FuzionSC2-14 - High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes


                    Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space.

                    Universal provides complete solutions to meet specific requirements by leveraging its portfolio of flexible platforms for surface mount, through-hole, advanced semiconductor packaging, light mechanical, and final assembly processes. This best-in-class equipment set is complemented by state of the art software and operational services to help customers monitor and manage operational activities, improve efficiency and lower overall costs of manufacturing. Universal provides exclusive manufacturing process expertise through its world-renowned Advanced Process Lab, and delivers lasting value and support throughout all phases of the ownership experience through a global service infrastructure. Universal maintains offices in the Americas, Europe, and Asia, and is represented through a worldwide direct sales and distributor network.

                    For manufacturers who want to maximize return on investment for their electronics assembly solutions across the overall product life cycle, Universal Instruments delivers comprehensive, customer-focused solutions for all electronics production environments.

                    Leveraging innovative technologies and exclusive expertise, Universal solutions optimize time to market, overall efficiency for volume production, and investment protection for any product mix.

                    • 质量承诺
                    • 正品保修
                    • 送货到家
                    • 交易简单化

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