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Power supply: 100~220V +/-10%
Rated power: 6800W
Upper power: 1200W
Lower power: 1200W
IR power: 4200W
Operation mode: fully automatically desodoldering, pick-up, mounting and soldeirng
Main configuration: Auto feeding and recycling system, HD touchscreen for temperature profile setting and analysis and optical alignment system
Temperature profile storage: more than 50000 groups
OPtical CCD : With chio-feeder, automatically run for feeding or recycling, and aligning.
PCB position: Up and down intelligent positioning, bottom "5-point support" with V-groove fixed PCB which can be adjusted freely in the X-axis direction, with universal fixtures meanwhile
BGA position: Laser point dedicated to find the center of chip so that chip and PCB put quickly
Chip: 1*1~70*70mm
Chip spacing: 0.15mm
Dimension: L970*W850*H950 mm
Weight: 120kg
