EMIN tham gia triển lãm NEPCON 2017 tại Trung tâm Hội chợ Triển lãm quốc tế I.C.E 91 Trần Hưng Đạo, Hà Nội

SiC and GaN semiconductor components feature high power density and compact dimensions, causing heat to be concentrated within a very small chip area. The question of which thermal management solution is most widely used is often framed as a choice between four options: fans, heatsinks, thermal pads, or thermal grease. This framing requires some refinement, as these four components occupy different positions along the same heat-transfer path; in fact, most designs employ a combination of several of these elements. This article explains the role of each component, how to select thermal interface materials, and the impact of temperature on measurements.

EMIN GROUP participated in the Vietnam Industrial & Manufacturing Fair 2026 (VIMF Bac Ninh 2026), held from November 4 to 6, 2025, at Kinh Bac Cultural Center in Bac Ninh City.

Bidirectional DC power supplies combine source and sink operation in one platform. This supports realistic EV battery cycling, regenerative energy handling, programmable test sequences, and flexible battery or charger emulation.

For safer high-power DC testing, assess five protection functions: OVP, OCP, OTP, reverse-polarity protection, and short-circuit/fault protection. Together, they address abnormal voltage, current, heat, wiring, and system-fault conditions.

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