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Description
PD 955 M is a thermosetting single component,
solvent-free polymer adhesive, developed especially for the surface mounting of
SMT components onto PCBs and for use on bare substrates. This rheology is
specially adapted for high speed dispensing
Key Benefits
Very wide processing window, no tendency towards
stringing
Excellent adhesion with standard and also with
difficult to glue components
Consistent batch-to-batch quality
Applications
Dispensing
Physical Properties
Cleaning
Instructions
Before curing: The adhesive can be removed with Zestron HC and other Zestron and Vigon cleaning materials.
After Curing: Defective components can be replaced by heating (with hot air) the cured adhesive joint above
Adhesive Conditioning.
Remove adhesive from fridge: Before opening the package leave it for at least 2 hours at room
Do not open cartridge while adhesive is cold to prevent condensation
Before using adhesive cartridge: Before inserting nozzle, press small quantity of glue out of cartridge
