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- PCB & Component Requirements
Max.PCB size: 540mm x450mm
Max.PCB thickness: 0.5~4mm
Max.BGA size: 80mm x 80mm
Min.BGA size: 4mm x 4mm
Max. BGA weight: 80g
- Vision System Specifications
Max. visible area: 40mm x 40mm
Min. Pitch: /0.15mm
Micrometer Adjust Range: Front/Rear ± 5mm Left/Right ± 5mm
Rotation Angle: 360°
- Thermal Specifications
Max.temp.for hot-air heater: 350° C
Max.temp.for IR heater: 400° C
Temperature control: 8-Stage Programmable Temperature Settings
Upper heater power: 1200W
Lower heater power: 800W
Bottom IR heater power: 3600W
- Dimensions & Power Requirements:
Machine dimension: 746mm (L) 710mm (W) 820mm (H)
Weight: Appox 90Kg
Power Requirements: Single Phase, 220VAC, 50/60 Hz,
