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Range: -65 to 175°C @ 23°C ambient
Accuracy: ±1.0°C; Stability: ±0.3°C
Cooling Power: 55W @ -55°C; 125W @ -40°C; 250W @ 0°C
Transition Rates: 25 to -40°C <35 sec, 25 to +125°C <1.5 min.
Temperature Sensors: Main sensor: RTD, DUT sensors: K thermocouple, Diode, 100Ω RTD, Analog
Temperature Calibration: Software calibrated
Communications Interface: Ethernet (TCP/IP), USB / Optional IEEE488, RS232
Maximum Force Allowable on Thermal Head: 980.6 N (220.4 Lbf)
DUT Dimensions: From 2 x 2mm to 50 x 50mm (0.079” x 0.079” to 2.0 x 2.0”)
Operator Interface:
5.25” color touch-screen, programmable with 0.1°C resolution
Preset temperatures,ramp,soak,cycle
Ramp rate control, Graphing and data logging, Web server, Offset calibration
Analog temperature inputs
Thermal Head: 89mm (3.5”) diameter
Thermal Head Hose: 1.8 meters (70”) long, optional 3.0 meters (118”) long
Frost Free Thermal Head: Low flow dry air or nitrogen purge 0.05cfm, -70°C (-94°F) dew point; Controlled automatically
Physical Dimensions: 610mm D x 445mm W x 445mm H (24”D x 17.5”W x 17.5”H)
System Weight: 66 Kg (145lbs.)
Noise Level: 55 dBA
Power Requirements:
115 VAC (±10%), 15 amp, 50/60Hz
208/230 VAC (±10%), 10 amp, 50/60Hz
Purge Dry Air Supply: User supplied, regulated, -70°C (-94°F) air or nitrogen, 0.1cfm at 0.2 BAR
Operating Environment:
Temperature: 5 to 35°C (40 to 95°F)
Humidity: 20 to 95% RH
Compliance: CE | RoHS | EU 517/2014 | designed to meet UL61010
Description
Temptronic® ThermoSpot® DCP-102 Bench Top Temperature Forcing System
For IC characterization, test, and failure analysis with 125W capacity at -40°C
Features
• High reliability thermal cycling without thermoelectric modules
• Temperature Range: -65 to 175°C
• Cooling Power: 55W at -55°C , 125W at -40°C
• 25 to -40°C <35 sec.
• Easy and secure thermal connection to in-circuit or test socketed DUT
• Communications: Ethernet, USB (optional IEEE, RS232)
The ThermoSpot Model DCP-102 benchtop temperature forcing system provides a highly responsive, thermally conductive path to quickly induce temperatures to the DUT. This highly reliable system – without thermoelectric modules - uses a thermal probe designed with an interchangeable ThermoBridgeTM to mate directly to your IC or other device under test. Using proprietary, robust refrigeration technology, ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. User-programmable temperatures, graphing, and data logging are established through the controller’s touch-screen or remote communications. The system provides fast and precise transitions of temperature at the IC, even with variations in device power, and can be used with Temptronic’s proven DUT Control technology using an imbedded diode or external thermocouple.
Datasheet
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