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Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible GenesisSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.
Ideal for SiP applications
High-mix to high-volume support
Handles up to 300mm wafers
Inline barcode scanning supports ALPs or Inkless wafer maps
Supports up to 4 per machine
