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Terasic Altera DE3 Development system

  • Manufacturer: Terasic
    Model: Altera DE3
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Manufacture: Terasic
Model: Altera DE3

1. FPGA Devices
- Stratix III EP3SL150 (DE3-150)
+ 142,000 logic elements (LEs)
+ 5,499K total memory Kbits
+ 384 18x18-bit multipliers blocks
+ 736 user I/Os
- Stratix III EP3SE260 (DE3-260)
+ 254,400 logic elements (LEs)
+ 14,688K total memory Kbits
+ 768 18x18-bit multipliers blocks
+ 736 user I/Os
- Stratix III EP3SL340 (DE3-340)
+ 338,000 logic elements (LEs)
+ 16,272K total memory Kbits
+ 576 18x18-bit multipliers blocks
+ 736 user I/Os
2.Kit contents
DE3 Board
TH08-HTG
1GB DD2 SO-DIMM Module
DE3 Quick Start Guide
USB to SD Card adaptor
THCB_HL8
THCB_SFF
250W Power Supply
Screw and Copper Pillar Package
SD Card
DE3 System CD
Type A-B USB cable (or FPGA programming and control
USB cable (AF/mini USB)
Altera Complete Design Suite DVD with the Nios II
Embedded Design Suite (EDS) and Quartus - II design software
AC Power cord
DE3 Power cable

Detail

Datasheets

Altera DE3 Development System

  1. Overview

The Altera DE3 ASIC prototyping development board allows researchers and engineers to access the high density and high performance FPGA - the Altera Stratix III. Starting with the Stratix III 3SL150 (142K logic elements), the DE3 is the perfect platform for creating your cutting edge design in programmable logic. The DE3-150 board can be stacked up to create a programmable fabric that is unequaled by any other board system in the world.

DE3 boards include the DE3-340 (338K logic elements) and the DE3-260 (254.4K logic elements) that are optimized with extra on-chip multipliers needed for DSP research and development. All of the DE3s can be stacked and all share the same set of function from the Terasic's daughter cards connected to them.

Multiple DE3s can be joined together to increase design gate count and performance.

Up to 10 DE3s can be stacked vertically where space is at a premium.

DE3s can also be arranged in a expanded flat pattern to accommodate additional daughter cards.

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