Trạm hàn chipset BGA điều khiển bằng tay ShuttleStar RW-B400C

Kích thước PCB : W50*D50~W450*D400mm
Độ dày PCB : 0.5~4mm
Điều chỉnh bàn làm việc: Trước/sau ±50mm , Trái/ phải ±200mm
Điều khiển nhiệt độ: Cặp nhiệt kế kiểu K, vòng kín
Bộ sấy ( hồng ngoại): 2700W
Bộ nhiệt trên ( khí nóng ): 400W
Bộ nhiệt dưới ( khí nóng ): 800W
Nguồn cung: 1 pha 220V, 50/60Hz, 4.5KW
Kích thước máy: L660*W630*H600mm
Trọng lượng: khoảng 60kgs
Cung cấp kèm theo đầu thổi phía dưới  tiêu chuẩn và 5 đầu thổi phía trên

Khách hàng lựa kích thước đầu thổi phía trên chọn theo yêu cầu như sau:
6x6mm, 7x7mm, 8x8mm, 9x9mm, 10x10mm, 11x11mm, 12,12mm, 13,13mm, 15x15mm, 18x18mm, 21x21mm, 23x23mm, 24x24mm, 25x25mm, 26x26mm, 27x27mm, 31x31mm, 34x34mm, 35x35mm, 36x36mm, 38x38mm, 41x41mm, 44x44mm,48x48mm, 50x50mm, 52x52mm, 55x55mm, 60x60mm,  52x56mm

Chi tiết


Made of high quality heating material, desoldering and
 soldering procedures of BGA are precisely controlled;
Air flow and temperature are adjustable in a wide range
to produce high temperature breeze;
Movable heating head, which can be moved horizontally;
 easy to operated;
The temperatures of the upper and lower hot air guns can be
 precisely controlled according to their specific
 temperatures. The infrared constant temperature heating zone
 at the lower part and the appropriate temperature-
 control settings make the rework safer and more reliable;
Touch screen interface, PLC control, real-time temperature curve display,
 be able to display temperature curves
 and detecting curves at the same time;
Powerful cross flow fans cool the lower heating area rapidly;
6 segments of temperature up (down) and 6 segments constant
temperature control, 200 groups of temperature
 curves are stored, Curve analysis can be carried out on the touch screen;
The supports for the BGA soldering supporting frame are
micro-adjustable to restrain local sinkage;
The adjustable PCB positioning support, onto which the special
 fixtures for allotype board could be installed,
 enables easy and fast positioning of the PCB board;
Buzz after soldering is finished or desoldering, Hand vacuum pen
 is adjustable for removing BGA;
Both the upper and lower parts are equipped with over-temperature
 alarming and protection apparatus;
With different alloy hot gas nozzles, easy to replace,
It could be tailored as per the specific requirements;
The integrated design of machine and chassis is room-saving,
could be altered to instrument-control.


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