Trạm hàn BGA ShuttleStar RW-E500A

Kích thước PCB : W20*D20~W600*D500mm
Độ dày PCB : 0.5~4mm
Điều chỉnh bàn làm việc: Trước/sau ±10mm , Trái/ phải ±10mm
Điều khiển nhiệt độ: Cặp nhiệt kế kiểu K, vòng kín
Bộ nhiệt trên ( khí nóng ): 1000W
Bộ nhiệt dưới ( khí nóng ): 1000W
Bộ sấy hồng ngoại :6000W
Nguồn cung: 1 pha 380V, 50/60Hz, 10KW
Cấp khí: 5~8kgf/cm, 8L/min
Kích thước máy:  L1350*W800*H1800mm
Trọng lượng: appox 180kg

Chi tiết

Hot air head and mounting head are designed 2 in 1, and, can store 5,0000 groups
of working locations,with the function of auto soldering and mounting;
Driven by X and Y axes step motor, operated with rocker bar ,
micro-movable when approaching the destination;able to store unlimited data;
able to automatically suck BGA for soldering; after that, automatically place BGA to designated location;
Color optical system with functions of split vision, zoom-in and micro-adjustment,
equipped with abbreviation   detection device, auto focus, software operation,
30X optical focus, able to rework BGA sized up to 70mm×70mm;
Embedded industrial computer, touch screen interface, PLC control,
real-time temperature curve display,  able to display set curves and 9 detecting curves at the same time;
Color LCD monitor;
Suction nozzle can identify automatically material and mounting height,
can constrain the pressure within a small  range of 30~50g;
Connected with nitrogen outside for nitrogen-protected soldering and desoldering;
Build-in vacuum pump, 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;
8 segments of temperature up (down) and 8 segments constant temperature control,
 5,0000 groups of temperature curve are stored, connected with computer, unlimited storage of curves;
 curve analysis can be carried out on the touch screen, comparing with the history saved curves;
 with computer communication function, communication software is attached;
Three independent heating areas, temperature and time can be displayed digitally on the touch screen,
can rework CGA;
Both upper and lower hot-air heating heads are movable on the IR preheating area to fit for reworking BGA
 in different positions on PCB;
Control independently through external computer, and finish all functions;
Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect;
 heating board is independently controlled;
Equipped with different alloy hot air nozzles, easy to replace, be able to locate in any angle.


  • Cam kết chất lượng
  • Bảo hành chính hãng
  • Giao hàng tận nơi
  • Đơn giản hóa giao dịch

Đăng ký nhận bản tin - cơ hội nhận khuyến mãi